2.54mm 7001 Style Wafer Reverse Right Angle Dip
Material & Finish:
*Housing: Nylon 66, UL94V-2.
*Terminal: Copper Alloy, Tin Plated.
Specification:
*Voltage Rating: 250V AC/DC.
*Current Rating: 3 Amp AC/DC.
*Withstanding Voltage: 1000V AC/Minute.
*Insulation Resistance: 1000MΩ min.
*Contact Resistance: 20mΩ max.
*Operating Temperature: -25°C ~ +85°C.
*RoHS Compliant.
Please click Inquiry button below or OEM/ODM service and fill out the Form if you have any design or requirement.
Part No. 7001**RT-REV
Item No.
Description 2.54mm 7001 Style Wire to Board Wafer, Reverse Right Angle Dip, Position Option (**): 02 ~ 20
Inquiry
Each PCS